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IC plating chemicals
Plating Pre-treatment > Detape

Adhesive tape which utilizes the properties of heat-resistant and chemical-resistant are wildly applied in molding and pre-wire process for preventing flash (glue) remains on the specific type of leadframes. After the process of plasma at high temperature, the glue residue is generally remaining on the leadframe as remove the tape. The glue residue could be dissolved and peeled off in our chemicals by dipping process. Common resin of tape glue can be divided into two kinds of system, e.g., acrylic based and silicone type. Our R&D team will develop and provide the most suitable product to the customer.

 

 

 

 

 

Product Name Description Features
SID-103 To remove the silicone type residue.
  1. Unlike the chemical with solvent, SID-103 is un-flammable and lower COD.
  2. It’s easy on on-line management and waste treatment.
SID-113 To remove the acrylic type residue.
  1. Unlike the chemical with solvent, SID-112 is un-flammable and lower COD.
  2. It’s easy on on-line management and waste treatment.