The tin-lead stripper is developed for the field of IC package. The tin-lead plate layer and intermetallic compound (IMC) can be stripped rapidly from the substrates of Cu and Fe-Ni alloy. Contrary to the stripped substrates, the etching rate is very low. Stripping time is positively correlated with the operating temperature. That is, the tin stripping efficiency increases with increasing the operating temperature.
If the tin layer is stored for a long time or baked at high temperature, the IMC layer becomes thicker and the stripped rate decreases, as indicated in figure below.
|TLS-171||A tin-lead stripper developed for tin stripping of IC packaging process. It can quickly and completely peel off the tin-lead coating and its intermetallic compound on the copper or copper alloy substrate.||
|SRS-300||A stripper developed for IC packaging, lead-free tin and tin/bismuth coatings, which can quickly achieve the stripping effect.||