There are two major exposure tools, aligner and stepper. For the example of positive tone resist, the exposure-area could be developed/removed; and the un-exposure area is used for a hard mask. Light source, exposure dose…etc. are depended on the photo-resist.

 

 

For the positive tone resist, development is removing the exposure area, and un-exposure area will be removed in case of negative tone resist. It is a dissolved selectivity issue in between exposure and un-exposure areas during the development. 

It is called photo-acid will be generated by photochemical reaction. During the development, because of developer is base solution, the salts which made by acid-base neutralization could be easily removed with DI water. Assumed the dissolution rate is S; S will be increased in exposure area, and will become smaller in un-exposure area. it is because that AZO coupling generated by DNQ and Novolak in alkaline solution.

 

                                              

 

 

SST provides customers both MIF and MIC developers. 

MIF, TMAH has a standard 2.38% (0.261N) with different additive to reduce the damage on metal surface and surface tension. 

MIC, SBD-700 series include both potassium- and sodium-based alkaline solution and could be customized by different purposes.