Products

Product

Etching of Copper,

 

 

 

High Speed Etching of Copper (Cu Deburr)

 

Ti Etchant:

 

High Speed Etching of Silver (Ag Deburr)


品名 簡介 特性
SCE Series Acidic copper etching solution applied for wafer processing 1.Does not contain hydrogen peroxide, long etching life
2. The etching rate can be customized
STE Series Acidic titanium etching solution suitable for wafer processing. 1.Does not contain hydrofluoric acid
2. The etching rate can be customized
SAE Series Acid/alkaline aluminum etching solution suitable for wafer processing. 1.Single agent use
2. Etching rate, acidity and alkalinity can be customized
SSE Series Alkaline silver etching solution suitable for packaging process. 1.Two agent use
2. Can quickly remove silver burrs due to the cutting process