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Rework / stripping chemicals
Tin Rework > Copper and Copper Alloy Substrates

The tin-lead stripper is developed for the field of IC package. The tin-lead plate layer and intermetallic compound (IMC) can be stripped rapidly from the substrates of Cu and Fe-Ni alloy. Contrary to the stripped substrates, the etching rate is very low. Stripping time is positively correlated with the operating temperature. That is, the tin stripping efficiency increases with increasing the operating temperature.

 

If the tin layer is stored for a long time or baked at high temperature, the IMC layer becomes thicker and the stripped rate decreases, as indicated in figure below.

 

 

Product Name Description Features
TLS-171 A tin-lead stripper developed for tin stripping of IC packaging process. It can quickly and completely peel off the tin-lead coating and its intermetallic compound on the copper or copper alloy substrate.
  1. Does not contain H2O2.
  2. It does not damage the package compound, and the ink mark does not fall off and turn yellow after processing.
  3. No smut after treatment.
  4. Does not produce NOx toxic gas.
SRS-300 A stripper developed for IC packaging, lead-free tin and tin/bismuth coatings, which can quickly achieve the stripping effect.
  1. Does not contain H2O2, hydrofluoric acid.
  2. It will not damage the package compound, and the ink mark will not fall off and turn yellow after processing.
  3. The bite rate of the lead frame material is extremely low, and the substrate does not produce smut after processing.
  4. Does not produce NOx toxic gas.
  5. Single-dose use, easy management and control.