The tin-lead stripper is developed for the field of IC package. The tin-lead plate layer and intermetallic compound (IMC) can be stripped rapidly from the substrates of Cu and Fe-Ni alloy. Contrary to the stripped substrates, the etching rate is very low. Stripping time is positively correlated with the operating temperature. That is, the tin stripping efficiency increases with increasing the operating temperature.
If the tin layer is stored for a long time or baked at high temperature, the IMC layer becomes thicker and the stripped rate decreases, as indicated in figure below.
|TLS-171||TLS-171 is formulated for removing the defected tin plating layer from Cu or Fe-Ni alloy without damage to the substrate.||
|SRS-300||SRS-300 is formulated for speedy removing defected tin alloys plating layer from substrate.||