Pure Tin Additive
Pure tin plating additive, comprising fast continuous line (505MT) and roll rack line (155MT).
Additive of continuous line (505MT):
SEM image of the surface of tin plating

Wetting Balance Test

Whisker Test



Additive of roll rack line (155MT):
Whisker Test


| 品名 | 簡介 | 特性 |
|---|---|---|
| 505MT | Additive of Developed Pure Tin (Whisker-Less) Plating Process. |
1.Suitable for high speed electroplating production line. 2. Excellent solderbility. Low carbon containing and lower stress electrodeposit. Easy management. Uniform. |
| 155MT | Designed for Pure Tin Develop the Rolling or Hanging Suspended Application of Additive Plating. |
1.Under current density differences, we can get good plating film appearance of uniformity. 2. Excellent uniformity of electricity significantly. 3. Lattice structure and stability and uniformity of size. Location of the solder and after processability. 4. Bath stability is good, not easy to produce tetravalent tin. |
| SIT-101 | Chemical tin plating agent |
1.Electroless, apply for tin plating reprocess. |

