Products
ProductEtching
Etching of Copper,
High Speed Etching of Copper (Cu Deburr)
Ti Etchant：
High Speed Etching of Silver (Ag Deburr)
| 品名 | 簡介 | 特性 |
|---|---|---|
| SCE Series | Acidic copper etching solution applied for wafer processing |
1.Does not contain hydrogen peroxide, long etching life 2. The etching rate can be customized |
| STE Series | Acidic titanium etching solution suitable for wafer processing. |
1.Does not contain hydrofluoric acid 2. The etching rate can be customized |
| SAE Series | Acid/alkaline aluminum etching solution suitable for wafer processing. |
1.Single agent use 2. Etching rate, acidity and alkalinity can be customized |
| SSE Series | Alkaline silver etching solution suitable for packaging process. |
1.Two agent use 2. Can quickly remove silver burrs due to the cutting process |