Products
ProductMetal Etching
Copper Etchant:
Besides according with the RDL, Copper Pillar Bump and LF Bump process requirements of general packaging processes, there are also corresponding products for the advanced packaging processes of semiconductor, such as Fine Line RDL, Cu/Ni/Au RDL, Microbump, and Ni/Au Pad structures.
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Ti Etchant:
In the UBM structure (Under Bump Metallization) of the packaging process, the sputtered titanium layer is often used as the adhesion layer and diffusion barrier layer between the sputtered copper layer and the substrate. Titanium etching residues and defects can cause short circuits in components or lower their reliability. At present, Ti etchants for hydrofluoric acid and acid fluoride salt systems is provided, which can effectively inhibit the etching of Cu, Al, and Lead frame solder. When the client cannot treat fluoride-containing wastewater, alkaline etchant with hydrogen peroxide can also be provided as a solution.
Other examples of applications are as follows
High Speed Etching of Copper (Cu Deburr)
High Speed Etching of Silver (Ag Deburr)
| 品名 | 簡介 | 特性 |
|---|---|---|
| SCE Series （Persulfate system） | Acidic copper etching solution applied for wafer processing |
1. Does not contain hydrogen peroxide, long etching life 2. The etching rate can be customized |
| SCE Series （Hydrogen peroxide system） | Acidic copper etching solution applied for wafer processing |
1. Contains hydrogen peroxide, which can achieve a high etching rate 2. The etching rate can be customized and adjusted |
| STE Series (Containing fluoride salts) | Acidic titanium etching solution suitable for wafer processing. |
1. Does not contain hydrofluoric acid 2. The etching rate can be customized |
| STE Series (Containing Hydrofluoric Acid) | Acidic titanium etching solution suitable for wafer processing. |
1. Contains hydrofluoric acid. At room temperature, a high etching rate can be achieved 2. The target etch rate can be customized and adjusted |
| STE Series (Contains alkaline salts) | Alkaline titanium etching solution suitable for wafer fabrication process. |
1. Two agent use 2. The operating temperature can be adjusted to achieve a high etching rate |
| SAE Series | Acid aluminum etching solution suitable for wafer processing. |
1. Single agent use 2. Etching rate can be customized |
| SSE Series （Contains Ammonia） | Alkaline silver etching solution suitable for packaging process. |
1. Two agent use 2. Can quickly remove silver burrs due to the cutting process |
| SSE Series （Contains chelate Salts） | Neutral to weakly acidic silver etching solution for iron-nickel based substrates. |
1.Two agent use 2. The silver layer can be removed quickly without damaging the iron-nickel based substrate |